The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Aug. 06, 2015
Applicant:
Ibiden Co., Ltd., Ogaki, JP;
Inventors:
Keisuke Shimizu, Ogaki, JP;
Makoto Terui, Ogaki, JP;
Ryojiro Tominaga, Ogaka, JP;
Yuichi Nakamura, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 3/4694 (2013.01); H05K 1/0224 (2013.01); H05K 3/305 (2013.01); H05K 3/429 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2072 (2013.01);
Abstract
A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.