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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9832878 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Aug. 06, 2015

Wiring board with cavity for built-in electronic component and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Keisuke Shimizu, Ogaki, JP;

Makoto Terui, Ogaki, JP;

Ryojiro Tominaga, Ogaka, JP;

Yuichi Nakamura, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 3/4694 (2013.01); H05K 1/0224 (2013.01); H05K 3/305 (2013.01); H05K 3/429 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2072 (2013.01);
Abstract

A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.

Find Patent Forward Citations

Shimizu, Keisuke. (2017). Wiring board with cavity for built-in electronic component and method for manufacturing the same (U.S. Patent No. 9832878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9832878

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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