Ogaki, Japan

Ryojiro Tominaga

This inventor holds 14 USPTO granted patents and 1 published patent application, primarily in Wiring Board Technology. Top assignee: Ibiden Company Limited. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryojiro Tominaga. Retrieved from https://idiyas.com/inventor/ryojiro-tominaga

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 44(Granted Patents)


Location History:

  • Ibi-gun, JP (2013)
  • Gifu, JP (2014)
  • Ogaki, JP (2013 - 2017)
  • Ogaka, JP (2017)

Company Filing History:


Years Active: 2013-2017

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Areas of Expertise:
Wiring Board
Printed Wiring Board
Manufacturing Method
Electronic Component
Wiring Substrate
Cavity Design
Metal Film
Substrate Manufacturing
14 patents (USPTO):Explore Patents

Title: Ryojiro Tominaga: Innovator in Wiring Board Technology

Introduction

Ryojiro Tominaga is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 14 patents. His innovative designs have paved the way for advancements in electronic component integration.

Latest Patents

Tominaga's latest patents include a wiring board with a cavity for a built-in electronic component and a method for manufacturing the same. This invention features a conductor layer that includes a conductor circuit layer and a plane layer, along with an insulating layer that has a cavity. The cavity is designed to mount a built-in electronic component on the exposed portion of the plane layer. Additionally, the plane layer has a recess structure formed in its outer peripheral portion.

Another notable patent is a wiring board with a built-in electronic component, which consists of a substrate with a cavity that accommodates an electronic component. This design includes a conductive layer extending over the electronic component and a solder-resist layer with openings that form pads for electrical connections. The innovative structure ensures efficient integration and functionality of electronic components.

Career Highlights

Ryojiro Tominaga is currently associated with Ibiden Company Limited, where he continues to develop cutting-edge technologies in wiring boards. His work has significantly impacted the electronics industry, enhancing the performance and reliability of electronic devices.

Collaborations

Tominaga has collaborated with notable colleagues, including Atsushi Ishida and Kenji Sakai. Their combined expertise has contributed to the successful development of innovative wiring board technologies.

Conclusion

Ryojiro Tominaga's contributions to wiring board technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of electronic component integration, making him a key figure in the advancement of this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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