The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Sep. 30, 2013
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Ryojiro Tominaga, Ogaki, JP;

Keinosuke Ino, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 41/00 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 41/005 (2013.01); H05K 1/165 (2013.01); H01F 2017/002 (2013.01); H01F 2027/2809 (2013.01); H05K 1/0216 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/096 (2013.01); Y10T 156/10 (2015.01);
Abstract

A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.


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