The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Feb. 10, 2016
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventor:

Keisuke Shimizu, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/00 (2006.01); H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01);
Abstract

A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the semiconductor has a terminal on the active surface, a first build-up layer including an insulating layer and first conductor pads such that the first conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate, and a second build-up layer including an insulating layer and second conductor pads such that the second conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate. The insulating layer in the first build-up includes resin material and reinforcing material, the insulating layer in the second build-up includes resin material and reinforcing material, and the first conductor pads is embedded in the insulating layer in the first build-up.


Find Patent Forward Citations

Shimizu, Keisuke. (2017). Semiconductor element built-in wiring board and method for manufacturing the same (U.S. Patent No. 9793219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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