Keishi Okamoto

This inventor holds 22 USPTO granted patents, primarily in High-Density Interconnection. Top assignee: International Business Machines Corporation. Active years: 2014-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keishi Okamoto. Retrieved from https://idiyas.com/inventor/keishi-okamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22

% Patents Active = 77.3

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 44(Granted Patents)

Location History:

Tokyo, JP (2016 - 2017)
Kanagawa, JP (2015 - 2022)
Kawasaki, JP (2014 - 2024)

Company Filing History:

22 out of 166,351

International Business Machines Corporation

patents

Years Active: 2014-2024

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Areas of Expertise:

High-Density Interconnection

Solder Joints

Organic Substrate

Chip Mounting

Wireless Communication

Electrical Connection

Circuit Board Formation

Sacrificial Interposer

Optical Waveguide

Semiconductor Packaging

Millimeter Wave

Thermal Radiators

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12087596 - Controlling of height of high-density interconnection structure on substrate (2024-09-10),

2. 11456269 - Prevention of bridging between solder joints (2022-09-27),

3. 11264314 - Interconnection with side connection to substrate (2022-03-01),

4. 11114308 - Controlling of height of high-density interconnection structure on substrate (2021-09-07),

5. 11004819 - Prevention of bridging between solder joints (2021-05-11),

6. 10643910 - Fabrication of a sacrificial interposer test structure (2020-05-05),

7. 10622311 - High-density interconnecting adhesive tape (2020-04-14),

8. 10595399 - Method of reducing warpage of an organic substrate (2020-03-17),

9. 10529665 - High-density interconnecting adhesive tape (2020-01-07),

10. 10141278 - Chip mounting structure (2018-11-27),

11. 10109540 - Fabrication of sacrificial interposer test structure (2018-10-23),

12. 10090586 - Wireless communication device with joined semiconductors (2018-10-02),

13. 9967971 - Method of reducing warpage of an orgacnic substrate (2018-05-08),

14. 9941230 - Electrical connecting structure between a substrate and a semiconductor chip (2018-04-10),

15. 9893031 - Chip mounting structure (2018-02-13),

Title: The Innovative Journey of Keishi Okamoto

Introduction: Keishi Okamoto is a pioneering inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Keishi Okamoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Keishi Okamoto has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs in various industries.

Collaborations: Throughout his career, Keishi Okamoto has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange that has been instrumental in his success as an inventor.

Conclusion: Keishi Okamoto's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]