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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10622311 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Aug. 10, 2017

High-density interconnecting adhesive tape

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Akihiro Horibe, Yokohama, JP;

Hiroyuki Mori, Yasu, JP;

Keishi Okamoto, Kawasaki, JP;

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Vazken Alexanian

Primary Examiner:

Edward Chin

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/50 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73211 (2013.01);
Abstract

A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chip to be mounted. The interconnection substrate further includes an interconnection layer that includes a first set of pads for the first chip, a second set of pads for the second chip, traces and an organic insulating material. The interconnection layer is disposed on the base substrate and located within a defined area on the base substrate between the first group of electrodes and the second group of the electrodes.

Find Patent Forward Citations

Horibe, Akihiro. (2020). High-density interconnecting adhesive tape (U.S. Patent No. 10622311). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10622311

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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