The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jan. 16, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sayuri Hada, Tokyo, JP;

Hiroyuki Mori, Shiga-ken, JP;

Keishi Okamoto, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/02 (2006.01); G01B 21/08 (2006.01); G01B 21/20 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G01B 21/08 (2013.01); G01B 21/20 (2013.01); H05K 1/0298 (2013.01); H05K 1/0313 (2013.01); H05K 3/0011 (2013.01); H05K 3/225 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09909 (2013.01); H05K 2203/013 (2013.01); H05K 2203/163 (2013.01);
Abstract

An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.


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