The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Dec. 30, 2015
International Business Machines Corporation, Armonk, NY (US);
Keiji Matsumoto, Kanagawa-ken, JP;
Keishi Okamoto, Kanagawa, JP;
Yasumitsu K. Orii, Shiga-ken, JP;
Kazushige Toriyama, Kanagawa, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides an electrical connecting structure between a substrateand a semiconductor chip. The electrical connecting structure comprises a metal bumpformed on a contact padof a semiconductor chipand a coating layerformed on the metal bumpof the semiconductor chip. The coating layer includes material not wettable with solder. The electrical connecting structure further comprises a metal padformed on the substrate. The electrical connecting structure further comprises a solderconnecting to a side surface of the metal bumpand an outer surface of the metal pad. The outer surface is not covered by the coating layer