The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Sep. 27, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Risa Miyazawa, Kanagawa, JP;

Takahito Watanabe, Kanagawa, JP;

Hiroyuki Mori, Shiga-ken, JP;

Keishi Okamoto, Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01);
Abstract

An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.


Find Patent Forward Citations

Loading…