Company Filing History:
Years Active: 2020-2024
Title: Kazuto Aizawa: Innovator in Semiconductor Processing
Introduction
Kazuto Aizawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor processing, holding a total of 5 patents. His innovative work has paved the way for advancements in technology and manufacturing processes.
Latest Patents
Aizawa's latest patents include an adhesive tape specifically designed for semiconductor processing. This adhesive tape features a base material, a buffer layer on at least one surface side of the base material, and an adhesive layer on the other surface side. The buffer layer is engineered to have a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m. Additionally, the Young's modulus of the base material is higher than that of the buffer layer. Another notable patent is a semiconductor processing adhesive tape that includes a substrate, a buffer layer on at least one side of the substrate, and an adhesive layer on the other side. The buffer layer in this patent has an energy to break at 23° C. of 13 to 80 MJ/m.
Career Highlights
Kazuto Aizawa is currently employed at Lintec Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Aizawa has collaborated with notable colleagues such as Jun Maeda and Katsuhiko Horigome. These partnerships have contributed to the advancement of their shared goals in the field of semiconductor processing.
Conclusion
Kazuto Aizawa's contributions to semiconductor processing through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of technology and manufacturing.