The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Sep. 26, 2017
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); H01L 21/683 (2006.01); C09J 201/00 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/38 (2018.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); C09J 2301/312 (2020.08); H01L 2221/68327 (2013.01);
Abstract
The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E) of 20-1000 MPa at 60° C.