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For the Inventor, By the Inventor

Itabashi-ku, Japan

Lintec Corporation


USPTO Granted Patents = 652



Forward Citations = 3,456

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496 inventors (with patents filed for the assignee):

goldMedal Satoru Shoshi (34 out of 34 patents)

silverMedal Takeshi Kondo (30 out of 44 patents)

bronzeMedal Mikihiro Kashio (29 out of 29 patents)

4.  Kentaro Kusama (27 out of 27 patents)

5.  Kiichiro Kato (25 out of 25 patents)

6.  Satoshi Naganawa (25 out of 25 patents)

7.  Masaharu Ito (24 out of 52 patents)

8.  Toshio Sugizaki (24 out of 24 patents)

9.  Kenji Kobayashi (23 out of 106 patents)

10.  Kazuyoshi Ebe (22 out of 28 patents)

11.  Tomoo Orui (21 out of 21 patents)

12.  Baku Katagiri (21 out of 29 patents)

13.  Isao Ichikawa (21 out of 21 patents)

14.  Kunihisa Kato (21 out of 21 patents)

15.  Yumiko Amino (20 out of 21 patents)


Core Competencies:
Adhesive Sheets
Gas Barrier Laminate
Thermoelectric Conversion Module
Conductive Member
Pressure Sensitive Adhesive
Motion Detection Systems
Electromagnetic Wave Absorption Film
Reflective Display Body
Semiconductor Processing
Flexible Materials
Heating Devices
Light Diffusion Control

652 patents:

1. 12516223 - High-frequency dielectric heating adhesive sheet (2026-01-06),
2. 12473466 - Adhesive sheet (2025-11-18),
3. 12466170 - Gas barrier laminate (2025-11-11),
4. 12429557 - Pseudo sheet structure, sheet conductive member, and sensor device (2025-09-30),
5. 12408551 - Thermoelectric conversion module (2025-09-02),
6. 12406960 - Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate (2025-09-02),
7. 12404429 - Protective film (2025-09-02),
8. 12359096 - High-frequency dielectric heating adhesive sheet (2025-07-15),
9. 12351749 - Method of producing an adhesive sheet or a release liner (2025-07-08),
10. 12344501 - Sheet pasting device and sheet pasting method (2025-07-01),
11. 12341034 - Sheet pasting device and sheet pasting method (2025-06-24),
12. 12319852 - Method of bonding with adhesive sheets for high-frequency dielectric heating (2025-06-03),
13. 12288768 - Method of manufacturing laminate (2025-04-29),
14. 12286260 - Adhesion device and adhesion method (2025-04-29),
15. 12270641 - Motion detection member (2025-04-08),
LINTEC Corporation is a global leader in adhesive and surface technologies. With a focus on creating innovative solutions for various industries, LINTEC offers a wide range of products including adhesive films, specialty papers, and label materials. Their commitment to quality and sustainability has made them a trusted partner for businesses worldwide. For more information, visit their official website.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

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652 Patents

#2 in Itabashi-ku

#303 in Japan

#1,478 in the World

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Itabashi-ku, Japan

Lintec Corporation

Forward Citations = 3,456

496 inventors:

goldMedal Satoru Shoshi (34 out of 34 patents)

silverMedal Takeshi Kondo (30 out of 44 patents)

bronzeMedal Mikihiro Kashio (29 out of 29 patents)

4.  Kentaro Kusama (27 out of 27 patents)

5.  Kiichiro Kato (25 out of 25 patents)

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