The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Mar. 13, 2019
Applicant:
Lintec Corporation, Itabashi-ku, JP;
Inventors:
Koji Tsuchibuchi, Itabashi-ku, JP;
Kiichiro Kato, Itabashi-ku, JP;
Assignee:
LINTEC CORPORATION, Itabashi-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/40 (2018.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); B32B 37/04 (2006.01); B32B 37/15 (2006.01); C09J 123/08 (2006.01); B32B 37/00 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
C09J 7/405 (2018.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 27/32 (2013.01); B32B 37/04 (2013.01); C09J 7/40 (2018.01); C09J 123/08 (2013.01); C09J 123/0846 (2013.01); B32B 37/156 (2013.01); B32B 38/1866 (2013.01); B32B 2250/05 (2013.01); B32B 2307/7376 (2023.05); B32B 2307/748 (2013.01); B32B 2323/04 (2013.01); B32B 2323/043 (2013.01); B32B 2323/046 (2013.01); C09J 2203/31 (2013.01); C09J 2301/122 (2020.08); C09J 2301/124 (2020.08); C09J 2301/302 (2020.08); C09J 2423/04 (2013.01); C09J 2423/045 (2013.01); C09J 2433/00 (2013.01); C09J 2483/005 (2013.01);
Abstract
A substrate may be suitable for release sheet and may include, in this order, a support, an adhesion layer (X), and a resin layer (Y) containing polyethylene having a density of 930 kg/mor more and 960 kg/mor less, wherein convex portions are present on the surface of the resin layer (Y). A difference in height of the convex portions may be 0.5 μm or more.