Lintec Corporation

Kazuto Aizawa

Jun Maeda

Katsuhiko Horigome

An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.

Adhesive tape for semiconductor processing and method for producing semiconductor device

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23&#xb0; C. of 13 to 80 MJ/m.

Semiconductor processing adhesive tape and method of manufacturing semiconductor device

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23&#xb0; C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)&#xd7;(C) of (N) and (C) is 500 or more at 30&#xb0; C., and 9000 or less at 60&#xb0; C., where (N) [&#x3bc;m] is a thickness of the pressure sensitive adhesive layer and (C) [&#x3bc;m] is a creep amount.

Adhesive tape for semiconductor processing, and semiconductor device manufacturing method

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23&#xb0; C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E) of 100-2000 MPa at 23&#xb0; C., and a tensile storage elastic modulus (E) of 20-1000 MPa at 60&#xb0; C.

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Tokyo, Japan

Kazuto Aizawa