The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Jun. 04, 2019
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Kazuto Aizawa, Tokyo, JP;
Jun Maeda, Tokyo, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/08 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); C09J 7/29 (2018.01); C09J 7/385 (2018.01); H01L 21/78 (2013.01); B32B 2405/00 (2013.01); C09J 2433/006 (2013.01); C09J 2467/006 (2013.01); C09J 2475/006 (2013.01);
Abstract
An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.