The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Jun. 04, 2019
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Kazuto Aizawa, Tokyo, JP;
Jun Maeda, Tokyo, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 133/08 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/241 (2018.01); C09J 7/255 (2018.01); C09J 7/29 (2018.01); C09J 7/385 (2018.01); C09J 133/08 (2013.01); H01L 21/78 (2013.01); C09J 2423/006 (2013.01); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01);
Abstract
A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.