The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Sep. 29, 2017
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Kazuto Aizawa, Tokyo, JP;
Jun Maeda, Tokyo, JP;
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/00 (2006.01); H01L 21/683 (2006.01); C09J 201/00 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); C09J 133/00 (2006.01); C09J 7/29 (2018.01); C09J 7/24 (2018.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 201/00 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); C09J 2301/312 (2020.08); H01L 2221/68327 (2013.01);
Abstract
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.