Tokyo, Japan

Katsumi Miyawaki

This inventor holds 17 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Mitsubishi Electric Corporation, Mitsubishi Denki Kabushiki Kaisha. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsumi Miyawaki. Retrieved from https://idiyas.com/inventor/katsumi-miyawaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 88.2


Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2008-2026

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Areas of Expertise:
Microwave Device
Heat Spreader
Semiconductor Package
Heat Dissipation
Radiofrequency Device
Resin Flow Barrier
Molded Package
Manufacturing Method
Outer Peripheral Frame
High-Output Device
Antenna Design
Semiconductor Technology
17 patents (USPTO):Explore Patents

Title: The Innovations of Katsumi Miyawaki: A Semiconductor Visionary

Introduction: Katsumi Miyawaki, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technology with a remarkable portfolio of 16 patents. His inventive prowess reflects a deep understanding of electronic components and their integration, particularly in the design and packaging of semiconductor devices.

Latest Patents: Among his recent innovations, one notable patent involves a new semiconductor device that incorporates a thick copper member for mounting a semiconductor chip. This design features a printed circuit board that allows for efficient communication and connection between the semiconductor chip and the wiring pattern via conductive vias. Another significant patent is a semiconductor package that includes a heat dissipation structure along with an outer peripheral frame, effectively managing heat while ensuring structural integrity. This package creatively bonds two semiconductor chips of differing thicknesses to enhance performance and efficiency.

Career Highlights: Throughout his illustrious career, Miyawaki has served in prominent roles at influential companies such as Mitsubishi Electric Corporation and Mitsubishi Denki Kabushiki Kaisha. His experiences in these esteemed organizations have fueled his innovative mindset and allowed him to refine his technical expertise.

Collaborations: In his journey of innovation, Katsumi Miyawaki has worked alongside esteemed colleagues, including Hiroaki Ichinohe and Takao Moriwaki. These collaborations have fostered a collaborative environment that encourages creativity and leads to groundbreaking advancements in semiconductor technology.

Conclusion: Katsumi Miyawaki stands as a testament to the power of innovation in the semiconductor industry. His contributions have not only advanced technology but also set a precedent for future developments in the field, ensuring his legacy will continue to inspire generations of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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