The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
May. 26, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Katsumi Miyawaki, Tokyo, JP;
Kenichiro Chomei, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/49861 (2013.01);
Abstract
A semiconductor chip () is mounted on a heat sink (). Plural lead terminals () are connected to the semiconductor chip (). The plural lead terminals () include a first lead terminal through which a high frequency signal passes. Plural dielectric materials () separated from each other are individually provided between the plural lead terminals () and the heat sink (). Sealing resin () seals the semiconductor chip (), the plural lead terminals () and the plural dielectric materials ().