The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Dec. 29, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Masayasu Ito, Tokyo, JP;
Katsumi Miyawaki, Tokyo, JP;
Hiroaki Ichinohe, Tokyo, JP;
Takashi Tsurumaki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a heat sink, an integrated component in which a ceramic terminal having a microstrip line and a matching circuit are integrated into one unit, a lead fixed to the ceramic terminal, a matching substrate fixed to the heat sink, a semiconductor chip fixed to the heat sink, a plurality of wires configured to connect the matching circuit and the matching substrate and to connect electrically the matching substrate and the semiconductor chip, a frame configured to surround the matching substrate and the semiconductor chip in a plan view, and a cap provided on the frame.