The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Jan. 29, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Katsumi Miyawaki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/13 (2006.01); H01L 23/66 (2006.01); H01L 23/047 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/047 (2013.01); H01L 23/13 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01);
Abstract
A semiconductor device is provided with a base member having a front surface and a plurality of semiconductor chips provided on the front surface and each having a long side and a short side, the plurality of semiconductor chips being aligned so that the long sides are faced with each other. The plurality of semiconductor chips are provided diagonally, respectively, so that the adjacent semiconductor chips are inclined to the same side in a planar view of the front surface.