The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Feb. 16, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Katsumi Miyawaki, Tokyo, JP;
Tatsuto Nishihara, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/40 (2006.01); H01L 23/492 (2006.01); H01L 23/043 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 21/4803 (2013.01); H01L 23/043 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/4006 (2013.01); H01L 23/492 (2013.01);
Abstract
A radiofrequency high-output device includes: a base plate having a mount portion and a flange portion; a frame joined to an upper surface of the mount portion; and a semiconductor chip mounted on the upper surface of the mount portion in the frame, wherein a cut or an aperture in which a screw is inserted to fix the base plate is provided in the flange portion, and a groove is provided between the mount portion and the flange portion of the base plate.