The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Sep. 12, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Yukinobu Tarui, Tokyo, JP;
Makoto Kimura, Tokyo, JP;
Katsumi Miyawaki, Tokyo, JP;
Kiyoshi Ishida, Tokyo, JP;
Hiroaki Matsuoka, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A microwave device can include: a first multilayer resin substrate including a ground via hole; a semiconductor substrate at the first multilayer resin substrate and including a high frequency circuit; a conductive heat spreader at an opposite face of the semiconductor substrate from a face of the semiconductor substrate facing the first multilayer resin substrate; a resin over the first multilayer resin substrate and covering the semiconductor substrate and the heat spreader such that an opposite face of the heat spreader from a face of the heat spreader facing the semiconductor substrate is exposed as an exposed face; and a conductive film covering the resin and the heat spreader and touching the exposed face. The semiconductor substrate can include a ground through hole extending through the semiconductor substrate. The conductive film can be electrically connected to the ground via hole via the heat spreader and the ground through hole.