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For the Inventor, By the Inventor

Hsinchu, Taiwan

Jung-hua Chang

This inventor holds 14 USPTO granted patents and 7 published patent applications. Top assignee: Sky Tech Inc.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jung-hua Chang. Retrieved from https://idiyas.com/inventor/jung-hua-chang-5vckcsfp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 64.3

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal13 out of 54 
 
Sky Tech Inc.
 patents
where one patent can have more than one assignee

Years Active: 2024-2026

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14 patents (USPTO):Explore Patents
1. 12740372 - Wafer holding device having function of positioning wafer (2026-09-15),
2. 12740365 - Wafer holder device having heating function (2026-09-15),
3. 12734624 - Holder plate for negative pressure chucking, holder device for negative pressure chucking, and de-bonding station (2026-09-15),
4. 12672496 - Separation method of bonded substrates (2026-06-30),
5. 12643301 - Bonding machine with horizontal correction function and horizontal correction method thereof (2026-06-02),
6. 12421600 - 2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber (2025-09-23),
7. 12409612 - Bonding method and apparatus of substrates (2025-09-09),
8. 12403685 - Plate cooling device and de-bonding station with plate cooling device (2025-09-02),
9. 12040215 - Bonding machine with movable suction modules (2024-07-16),
10. 12031208 - Atomic layer deposition apparatus for powders (2024-07-09),
11. 12006571 - Atomic layer deposition apparatus for coating on fine powders (2024-06-11),
12. 11987883 - Powder atomic layer deposition apparatus for blowing powders (2024-05-21),
13. 11961753 - Substrate-bonding device (2024-04-16),
14. 11952662 - Powder atomic layer deposition equipment with quick release function (2024-04-09),

Title: Innovations by Jung-hua Chang

Introduction

Jung-hua Chang is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced processes and apparatuses. With a total of nine patents to his name, Chang continues to push the boundaries of innovation.

Latest Patents

Among his latest patents is the "2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber." This innovative process method involves providing a lower chamber and a reaction space defined therein. It includes an upper cover with a window and vent holes, sealing the chamber opening to form a reaction chamber. The design incorporates an outer tube body and an inner tube body, with a UV light source and an induction coil to enhance the process. Another notable patent is the "Bonding method and apparatus of substrates." This method outlines a procedure for bonding a first substrate to a second substrate within a confined chamber, utilizing controlled air flow to achieve optimal bonding conditions.

Career Highlights

Jung-hua Chang is currently employed at Sky Tech Inc., where he applies his expertise in developing cutting-edge technologies. His work has garnered attention in the industry, showcasing his ability to innovate and create practical solutions.

Collaborations

Throughout his career, Chang has collaborated with talented individuals such as Jing-cheng Lin and Chia-Cheng Ku. These partnerships

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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