The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Sep. 26, 2023
Sky Tech Inc., Hsinchu County, TW;
Jung-Hua Chang, Hsinchu County, TW;
Pei-Yun Chiang, Hsinchu County, TW;
SKY TECH INC., Hsinchu County, TW;
Abstract
A bonding method of substrates for bonding a first substrate and a second substrate. The method includes: placing the first substrate on a holding surface of a holder in a confined chamber; evacuating air from the confined chamber to vacuum the confined chamber to a predetermined low pressure value; placing the second substrate on a top of the first substrate; pressing to the second substrate onto the first substrate; and allowing an outside atmosphere air to slowly enter the confined chamber by a first flow coefficient; and allowing the outside atmosphere air to rapidly enter the confined chamber with a second flow coefficient, wherein the second flow coefficient is greater than the first flow coefficient.