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For the Inventor, By the Inventor

Hsinchu, Taiwan

Sky Tech Inc.


USPTO Granted Patents = 53


Forward Citations = 34

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24 inventors (with patents filed for the assignee):

goldMedal Jing-Cheng Lin (24 out of 522 patents)

silverMedal Jing-cheng Lin (19 out of 19 patents)

bronzeMedal Jung-hua Chang (13 out of 14 patents)

4.  Ta-Hao Kuo (11 out of 12 patents)

5.  Yu-Te Shen (11 out of 11 patents)

6.  Chia-Cheng Ku (7 out of 7 patents)

7.  Ching-Liang Yi (6 out of 6 patents)

8.  Jung-Hua Chang (6 out of 41 patents)

9.  Mao-chan Chang (4 out of 4 patents)

10.  Pierre Sommen (2 out of 2 patents)

11.  Yun-Chi Hsu (2 out of 2 patents)

12.  Chi-Hung Cheng (2 out of 2 patents)

13.  Hsin-Yu Yao (1 out of 1 patent)

14.  Pierre Frédéric Claude Sommen (1 out of 1 patent)

15.  Yao-Syuan Cheng (1 out of 1 patent)


Core Competencies:
Wafer Holder
Thin-Film Deposition
Atomic Layer Deposition
Bonding Machine
Substrate Processing
Electrostatic Separation
Gas Mixing Method
Vibrating Deposition
Quantum Dot Particles
Shielding Device
Powder ALD Equipment
Separation Method

53 patents:

1. 12740372 - Wafer holding device having function of positioning wafer (2026-09-15),
2. 12740365 - Wafer holder device having heating function (2026-09-15),
3. 12734624 - Holder plate for negative pressure chucking, holder device for negative pressure chucking, and de-bonding station (2026-09-15),
4. 12672496 - Separation method of bonded substrates (2026-06-30),
5. 12643301 - Bonding machine with horizontal correction function and horizontal correction method thereof (2026-06-02),
6. 12421600 - 2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber (2025-09-23),
7. 12409612 - Bonding method and apparatus of substrates (2025-09-09),
8. 12403685 - Plate cooling device and de-bonding station with plate cooling device (2025-09-02),
9. 12371790 - Wafer carrier with adjustable alignment devices and deposition equipment using the same (2025-07-29),
10. 12224159 - Gas mixing method to enhance plasma (2025-02-11),
11. 12198904 - Thin-film-deposition equipment (2025-01-14),
12. 12129541 - Deposition method for tuning magnetic field distribution of deposition equipment (2024-10-29),
13. 12125721 - Parallelism-adjustable bonding machine (2024-10-22),
14. 12123092 - Powder-atomic-layer-deposition device with knocker (2024-10-22),
15. 12040215 - Bonding machine with movable suction modules (2024-07-16),
Company Overview
Sky Tech Inc., based in Hsinchu, Taiwan, specializes in advanced atomic layer deposition technologies. The company focuses on developing innovative solutions for thin-film deposition, catering to the semiconductor and materials industries. Their expertise encompasses a range of core technologies, including wafer holders, bonding machines, and substrate processing techniques. Sky Tech Inc. is committed to enhancing manufacturing processes through cutting-edge methods such as electrostatic separation and gas mixing, positioning itself as a key player in the field of precision deposition technologies.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

53 Patents

#94 in Hsinchu

#386 in Taiwan

#13,323 in the World

Hsinchu, TW
Hsinchu, Taiwan

Sky Tech Inc.

Forward Citations = 34

24 inventors:

goldMedal Jing-Cheng Lin (24 out of 522 patents)

silverMedal Jing-cheng Lin (19 out of 19 patents)

bronzeMedal Jung-hua Chang (13 out of 14 patents)

4.  Ta-Hao Kuo (11 out of 12 patents)

5.  Yu-Te Shen (11 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sky Tech Inc.. Retrieved from https://idiyas.com/company/sky-tech

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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