For the Inventor, By the Inventor

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Hsinchu, Taiwan

Sky Tech Inc.

USPTO Granted Patents = 53

EPO Patents = 3

Forward Citations = 34

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21 inventors (with patents filed for the assignee):

Jing-Cheng Lin (24 out of 522 patents)

Jing-cheng Lin (19 out of 19 patents)

Jung-hua Chang (13 out of 14 patents)

4. Ta-Hao Kuo (11 out of 12 patents)

5. Yu-Te Shen (11 out of 11 patents)

6. Chia-Cheng Ku (7 out of 7 patents)

7. Ching-Liang Yi (6 out of 6 patents)

8. Jung-Hua Chang (6 out of 40 patents)

9. Mao-chan Chang (4 out of 4 patents)

10. Pierre Sommen (2 out of 2 patents)

11. Yun-Chi Hsu (2 out of 2 patents)

12. Chi-Hung Cheng (2 out of 2 patents)

13. Hsin-Yu Yao (1 out of 1 patent)

14. Pierre Frédéric Claude Sommen (1 out of 1 patent)

15. Yao-Syuan Cheng (1 out of 1 patent)

Core Competencies:

Atomic Layer Deposition

Thin-Film Deposition

Plasma Enhanced Deposition

Bonding Machines

Wafer Carrier Technology

Gas Mixing Methods

Shielding Mechanisms

Electrostatic Separation Devices

Quantum Dot Manufacturing

Vibrating Deposition Devices

Substrate Processing Chambers

Powder Deposition Equipment

53 patents: Sort by Forward Citations

1. 12740372 - Wafer holding device having function of positioning wafer (2026-09-15),

2. 12740365 - Wafer holder device having heating function (2026-09-15),

3. 12734624 - Holder plate for negative pressure chucking, holder device for negative pressure chucking, and de-bonding station (2026-09-15),

4. 12672496 - Separation method of bonded substrates (2026-06-30),

5. 12643301 - Bonding machine with horizontal correction function and horizontal correction method thereof (2026-06-02),

6. 12421600 - 2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber (2025-09-23),

7. 12409612 - Bonding method and apparatus of substrates (2025-09-09),

8. 12403685 - Plate cooling device and de-bonding station with plate cooling device (2025-09-02),

9. 12371790 - Wafer carrier with adjustable alignment devices and deposition equipment using the same (2025-07-29),

10. 12224159 - Gas mixing method to enhance plasma (2025-02-11),

11. 12198904 - Thin-film-deposition equipment (2025-01-14),

12. 12129541 - Deposition method for tuning magnetic field distribution of deposition equipment (2024-10-29),

13. 12125721 - Parallelism-adjustable bonding machine (2024-10-22),

14. 12123092 - Powder-atomic-layer-deposition device with knocker (2024-10-22),

15. 12040215 - Bonding machine with movable suction modules (2024-07-16),

Sky Tech Inc. is a leading technology solutions provider, specializing in IT consulting, software development, and digital marketing services. With a team of skilled professionals, we deliver innovative and customized solutions to help our clients succeed in today's competitive market. Our commitment to quality and customer satisfaction sets us apart as a trusted partner for businesses looking to harness the power of technology to drive growth and efficiency.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

53 Patents

#94 in Hsinchu

#384 in Taiwan

#13,296 in the World

Hsinchu, Taiwan

Sky Tech Inc.

Forward Citations = 34

21 inventors:

Jing-Cheng Lin (24 out of 522 patents)

Jing-cheng Lin (19 out of 19 patents)

Jung-hua Chang (13 out of 14 patents)

4. Ta-Hao Kuo (11 out of 12 patents)

5. Yu-Te Shen (11 out of 11 patents)

Please report any incorrect information to [email protected]

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