The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jan. 16, 2024
Applicant:

Sky Tech Inc., Hsinchu County, TW;

Inventors:

Jung-Hua Chang, Hsinchu County, TW;

Ta-Hao Kuo, Hsinchu County, TW;

Assignee:

SKY TECH INC., Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10P 72/78 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0432 (2026.01); H10P 72/78 (2026.01);
Abstract

A wafer holder device having a heating function includes a fixing ring, a holder plate, and a heating plate. The fixing ring surrounds a hollow area, and the fixing ring includes a top and a bottom. The hollow area connects the top and the bottom. The holder plate includes a holding surface and a bottom surface. The holder plate is removably fixed to the top of the fixing ring, and the bottom surface of the holder plate covers the hollow area. A coefficient of thermal expansion of the holder plate is smaller than a coefficient of thermal expansion of the fixing ring. The heating plate is provided within the hollow area for heating the bottom surface of the holder.


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