Hsinchu, Taiwan

Jing-cheng Lin

This inventor holds 19 USPTO granted patents and 16 published patent applications, primarily in Atomic Layer Deposition. Top assignee: Sky Tech Inc.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing-cheng Lin. Retrieved from https://idiyas.com/inventor/jing-cheng-lin-lel3uewn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 89.5

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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Areas of Expertise:
Separation Method
Bonding Machine
Wafer Carrier
Thin-Film Deposition
Deposition Equipment
Magnetic Field Distribution
Powder Atomic Layer Deposition
Shielding Mechanism
Substrate-Bonding Device
Adjustable Alignment Devices
Vibrating Deposition Device
19 patents (USPTO):Explore Patents

Title: Innovations of Jing-cheng Lin

Introduction

Jing-cheng Lin is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of technology, particularly in the area of deposition equipment. With a total of 17 patents to his name, Lin's work has had a substantial impact on the industry.

Latest Patents

One of his latest inventions is a wafer carrier with adjustable alignment devices and deposition equipment using the same. This innovative wafer carrier is designed to enhance the accuracy of alignment in deposition machines. It comprises a tray and several adjustable aligning devices that are strategically placed around the tray. These devices include a base and an alignment pin, which can be adjusted to align a clamp ring of the deposition machine. The ability to move the alignment pins relative to the tray allows for precise adjustments, improving the overall efficiency of the deposition process.

Another notable patent is the thin-film-deposition equipment, which features a main body, a carrier, and a shielding device. The main body contains a reaction chamber and two sensor areas that are smaller than the chamber. The shielding device consists of two shield members and a driver that enables them to move in opposite directions. This design allows for effective separation during the deposition process and provides a shielding state during cleaning, ensuring the protection of the carrier.

Career Highlights

Jing-cheng Lin is currently employed at Sky Tech Inc., where he continues to innovate and develop advanced technologies. His work has been instrumental in pushing the boundaries of what is possible in the field of thin-film deposition.

Collaborations

Lin collaborates with talented individuals such as Jung-hua Chang and Chia-Cheng Ku, contributing to a dynamic and innovative work environment.

Conclusion

Jing-cheng Lin's contributions to technology through his patents and innovations have established him as a key figure in the industry. His work continues to influence advancements in deposition equipment, showcasing the importance of innovation in driving progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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