The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 13, 2022
Sky Tech Inc., Hsinchu County, TW;
Jing-Cheng Lin, Hsinchu County, TW;
Jung-Hua Chang, Hsinchu County, TW;
SKY TECH INC., Hsinchu County, TW;
Abstract
A bonding machine with movable suction modules includes a first cavity, a second cavity, a pressing unit, a carrier, and a plurality of movable suction modules. The first cavity is configured to be connected to the second cavity to form a closed space therebetween. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The pressing unit faces the carrier and is configured to bond a substrate placed on the carrier. The movable suction modules are arranged in a plurality of setting grooves on a bearing surface of the carrier for absorbing and flattening the substrate placed on the bearing surface. The movable suction modules is displaceable along the bearing surface and continuously absorb and flatten a substrate in a process of aligning the substrate, to help improve accuracy of substrate alignment.