The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Sep. 26, 2023
Applicant:
Sky Tech Inc., Hsinchu County, TW;
Inventors:
Jung-Hua Chang, Hsinchu County, TW;
Ta-Hao Kuo, Hsinchu County, TW;
Assignee:
SKY TECH INC., Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01);
Abstract
A plate cooling device for cooling carrier plate of a wafer, includes a cooling plate and a plurality of contact pads. The cooling plate includes an upper surface; wherein the upper surface is provided with a cooling area for placing the wafer thereon. The contact pads are disposed on the upper surface. The contact pads protrude on the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier plate.