This inventor holds 1 USPTO granted patent. Top assignee: Sky Tech Inc.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Pei-Yun Chiang: Innovator in Substrate Bonding Technology
Introduction
Pei-Yun Chiang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique bonding method that enhances the efficiency and effectiveness of substrate connections.
Latest Patents
Pei-Yun Chiang holds 1 patent for his invention titled "Bonding method and apparatus of substrates." This patent describes a method for bonding a first substrate to a second substrate. The process involves placing the first substrate on a holding surface within a confined chamber, evacuating air to create a vacuum, and then pressing the second substrate onto the first. The method allows for controlled air entry into the chamber, optimizing the bonding process.
Career Highlights
Pei-Yun Chiang is currently employed at Sky Tech Inc., where he continues to innovate in substrate bonding technologies. His work has been instrumental in advancing the capabilities of bonding methods used in various applications.
Collaborations
Pei-Yun collaborates with Jung-hua Chang, a talented woman in the field. Together, they work on projects that push the boundaries of substrate bonding technology.
Conclusion
Pei-Yun Chiang's contributions to substrate bonding technology exemplify the spirit of innovation. His patent and ongoing work at Sky Tech Inc. highlight his commitment to advancing this important field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile