Jun Mo Koo

USPTO Granted Patents = 23 (Patent Applications = 2)

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 325(Granted Patents)

Company Filing History:

21 out of 1,812

Stats Chippac Pte. Ltd.

patents

1 out of 15

Jcet Semiconductor (shaoxing) Co., Ltd.

Years Active: 2012-2023

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23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11688612 - Semiconductor device and method of forming interposer with opening to contain semiconductor die (2023-06-27),

2. 10998248 - Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die (2021-05-04),

3. 10242948 - Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package (2019-03-26),

4. 9875911 - Semiconductor device and method of forming interposer with opening to contain semiconductor die (2018-01-23),

5. 9679824 - Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP (2017-06-13),

6. 9620455 - Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure (2017-04-11),

7. 9559039 - Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package (2017-01-31),

8. 9437538 - Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect (2016-09-06),

9. 9337116 - Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die (2016-05-10),

10. 9318441 - Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die (2016-04-19),

11. 9305854 - Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package (2016-04-05),

12. 9263301 - Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die (2016-02-16),

13. 9224647 - Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer (2015-12-29),

14. 9142515 - Semiconductor device with protective layer over exposed surfaces of semiconductor die (2015-09-22),

15. 8999760 - Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure (2015-04-07),

Title: Inventor Jun Mo Koo - Revolutionizing Technology in Singapore

Introduction: Jun Mo Koo is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Jun Mo Koo holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Jun Mo Koo has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the world of innovation.

Collaborations: Jun Mo Koo has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Jun Mo Koo's relentless pursuit of innovation and his passion for creating a better future through technology make him a true pioneer in the field of inventions.

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2 patents pending:

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