IDiyas

For the Inventor, By the Inventor

Zhubei, Taiwan

Jui-Feng Kuan

USPTO Granted Patents = 59 

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 240(Granted Patents)

DiyaCoin DiyaCoin = 0.29 


Inventors with similar research interests:


Location History:

  • Hsin-Chu, TW (2005 - 2023)
  • Zhubei, TW (2012 - 2023)
  • Hsinchu County, TW (2015 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal59 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2005-2025

where 'Filed Patents' based on already Granted Patents

59 patents (USPTO):
1. 12204839 - Method for integrated circuit design (2025-01-21),
2. 12197123 - Methods for making semiconductor-based integrated circuits (2025-01-14),
3. 12181722 - Structures and process flow for integrated photonic-electric ic package by using polymer waveguide (2024-12-31),
4. 12055800 - Semiconductor structure (2024-08-06),
5. 12029123 - Semiconductor structure and method of manufacturing a semiconductor structure (2024-07-02),
6. 11994713 - Directionally tunable optical reflector (2024-05-28),
7. 11852967 - Methods for making semiconductor-based integrated circuits (2023-12-26),
8. 11754794 - Semiconductor device including optical through via and method of making (2023-09-12),
9. 11740415 - Structures and process flow for integrated photonic-electric IC package by using polymer waveguide (2023-08-29),
10. 11609374 - Directionally tunable optical reflector (2023-03-21),
11. 11532613 - Structure and method for cooling three-dimensional integrated circuits (2022-12-20),
12. 11455453 - Integrated circuit design method, system and computer program product (2022-09-27),
13. 11314914 - Method and non-transitory computer readable medium of operating an electronic design automation platform for an optimal intgrated circuit design (2022-04-26),
14. 11275880 - Region based shrinking methodology for integrated circuit layout migration (2022-03-15),
15. 11182528 - Electromigration sign-off tool (2021-11-23),

Title: Jui-Feng Kuan: Pioneering Innovations in Semiconductor Technology

Introduction

In the bustling tech hub of Zhubei, Taiwan, inventor Jui-Feng Kuan has cemented his legacy as a trailblazer in the realm of semiconductor technology. With a remarkable portfolio of 53 patents and an unwavering dedication to excellence, Kuan continues to push the boundaries of innovation and inspire the next generation of inventors.

Latest Patents

Kuan's latest patents showcase his ingenuity and expertise in semiconductor-based integrated circuits. One of his innovations includes a method for making ICs that involves intricate calculations to ensure alignment with specific layout grids. Another groundbreaking patent features a semiconductor device incorporating optical through vias, revolutionizing the seamless integration of photodetectors with waveguides.

Career Highlights

Currently employed at Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), Kuan spearheads cutting-edge research and development initiatives that shape the future of semiconductor technology. His strategic vision and technical prowess have earned him recognition as a key player in the industry, driving advancements that impact various sectors worldwide.

Collaborations

Collaboration is at the heart of Kuan's success, as evidenced by his partnerships with esteemed colleagues such as Yi-Kan Cheng and Hui Yu Lee. Together, they form a dynamic team that combines diverse talents and perspectives to tackle complex technological challenges and deliver innovative solutions.

Conclusion

In conclusion, Jui-Feng Kuan's journey as an inventor exemplifies the power of relentless curiosity and passion for innovation. His groundbreaking patents, stellar career at TSMC, and collaborative spirit underscore his significant contributions to the field of semiconductor technology. As Kuan continues to shape the landscape of technological advancements, his legacy will inspire aspiring inventors to think boldly and push the boundaries of what is possible in the ever-evolving world of innovation.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…