The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Jul. 27, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yu-Hao Chen, Hsinchu, TW;

Hui Yu Lee, Hsinchu, TW;

Jui-Feng Kuan, Hsinchu, TW;

Chien-Te Wu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); H10N 10/01 (2023.01); H10N 10/17 (2023.01); H10N 10/80 (2023.01); H10N 10/852 (2023.01); H10N 10/855 (2023.01);
U.S. Cl.
CPC ...
G02F 1/0147 (2013.01); G02F 1/011 (2013.01); H10N 10/01 (2023.02); H10N 10/17 (2023.02); H10N 10/80 (2023.02); G02F 2203/50 (2013.01); H10N 10/852 (2023.02); H10N 10/855 (2023.02);
Abstract

A semiconductor structure includes, an optical component and a thermal control mechanism. The optical component includes a first main path that splits into a first side path and a second side path so that the first side path and the second side path are separated from one another. The thermal control mechanism configured to control a temperature of both the first side path and the second side path, wherein the first thermal control mechanism includes a first thermoelectric member and a second thermoelectric member that are positioned between the first side path and the second side path and the first thermoelectric member and the second thermoelectric member have opposite conductive types.


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