IDiyas

For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Hui Yu Lee

USPTO Granted Patents = 52 

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 94(Granted Patents)

DiyaCoin DiyaCoin = 0.20 


Location History:

  • Sinchu, TW (2022)
  • Hsin-Chu, TW (2013 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal52 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

where 'Filed Patents' based on already Granted Patents

52 patents (USPTO):
1. 12424515 - SOIC chip architecture (2025-09-23),
2. 12271029 - Directionally tunable optical reflector (2025-04-08),
3. 12230603 - Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer (2025-02-18),
4. 12167509 - Photonic heater (2024-12-10),
5. 12159830 - Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect (2024-12-03),
6. 12154842 - Heat dissipation structures for three-dimensional system on integrated chip structure (2024-11-26),
7. 12142574 - Semiconductor devices and methods of manufacture (2024-11-12),
8. 12085769 - Integrated circuit device and method (2024-09-10),
9. 12055800 - Semiconductor structure (2024-08-06),
10. 12029123 - Semiconductor structure and method of manufacturing a semiconductor structure (2024-07-02),
11. 11994713 - Directionally tunable optical reflector (2024-05-28),
12. 11756924 - Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer (2023-09-12),
13. 11754794 - Semiconductor device including optical through via and method of making (2023-09-12),
14. 11749584 - Heat dissipation structures (2023-09-05),
15. 11694973 - Electromagnetic shielding metal-insulator-metal capacitor structure (2023-07-04),

Title: Hui Yu Lee: Pioneering Sustainable Technology Innovations in Hsin-Chu

Introduction:

Hui Yu Lee, a prominent inventor based in Hsin-Chu, Taiwan, is a beacon of innovative spirit and commitment to sustainable technology. With a remarkable portfolio of 41 patents, his contributions are shaping the future of technology and igniting inspiration for the next generation of inventors.

Latest Patents:

Among his latest patents is the groundbreaking "Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer," revolutionizing the semiconductor industry with its efficiency and precision. Additionally, Lee's "Semiconductor device including optical through via and method of making" showcases his proficiency in integrating cutting-edge technology for enhanced functionalities.

Career Highlights:

Lee is a key figure at Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a leading semiconductor manufacturer globally. His innovative methodologies in semiconductor fabrication have significantly impacted the efficiency and reliability of electronic devices, positioning TSMC at the forefront of technological advancement.

Collaborations:

Collaborating with esteemed colleagues such as Yi-Kan Cheng and Jui-Feng Kuan, Lee has fostered a collaborative environment where ideas flourish and innovative solutions emerge. Their combined expertise and dedication have elevated the success of projects and propelled innovation in the semiconductor industry.

Conclusion:

In conclusion, Hui Yu Lee's inventive prowess and dedication to sustainable technology epitomize the essence of a forward-thinking inventor. His trailblazing patents and collaborative ventures not only drive advancements in technology but also inspire a wave of creativity among aspiring innovators worldwide. Lee's legacy continues to resonate in the tech industry, setting a high standard for innovation and sustainability.

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