New Fairfield, CT, United States of America

John Michael Cotte

This inventor holds 110 USPTO granted patents and 19 published patent applications and 6 EPO patents, primarily in Quantum Computing Technology (CPC class H01L24-13). Top assignees: International Business Machines Corporation, Jsr Corporation. Active years: 1998-2026.

USPTO Granted Patents = 110 (Patent Applications = 19)

% Patents Active = 52.7

EPO Patents = 6 (Patent Applications = 4)

Average Co-Inventor Count = 4.2

ph-index = 14

Forward Citations = 791(Granted Patents)

Forward Citations (Not Self Cited) = 767(Dec 10, 2025)

Inventors with similar research interests:

Location History:

New Fairfield, NY (US) (2007)
Yorktown Heights, NY (US) (2012 - 2013)
Armonk, NY (US) (2019 - 2021)
New Fairfield, CT (US) (1998 - 2024)

Company Filing History:

110 out of 166,159

International Business Machines Corporation

where one patent can have more than one assignee

Years Active: 1998-2026

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Areas of Expertise:

Cryogenic Quantum Computers

Quantum Chips

Electrical Connections

Bump Bonded Chip Assembly

Superconducting Airbridge

Through-Silicon-Vias

MEMS Switch Devices

Photovoltaic Devices

Semiconductor Packaging

Nanoporous Membrane

Thermal Control

Chemical Mechanical Planarization

110 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12557210 - Electronic apparatus minimizing differential thermal contraction for cryogenic quantum computers (2026-02-17),

2. 12324361 - Electrical connections between dissimilar materials at cryogenic temperatures (2025-06-03),

3. 12249748 - Edge capacitive coupling for quantum chips (2025-03-11),

4. 12150390 - Downstop and bump bonds formation on substrates (2024-11-19),

5. 12033981 - Create a protected layer for interconnects and devices in a packaged quantum structure (2024-07-09),

6. 11908756 - Interposer chips and enclosures for quantum circuits (2024-02-20),

7. 11804442 - Combined backing plate and housing for use in bump bonded chip assembly (2023-10-31),

8. 11676903 - Combined backing plate and housing for use in bump bonded chip assembly (2023-06-13),

9. 11380974 - Superconducting airbridge crossover using superconducting sacrificial material (2022-07-05),

10. 11111136 - Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices (2021-09-07),

11. 10833016 - Semiconductor device including superconducting metal through-silicon-vias and method of making the same (2020-11-10),

12. 10734567 - Bump bonded cryogenic chip carrier (2020-08-04),

13. 10727391 - Bump bonded cryogenic chip carrier (2020-07-28),

14. 10727192 - Multiple sized bump bonds (2020-07-28),

15. 10651099 - Non-destructive testing of integrated circuit chips (2020-05-12),

Title: The Inventor John Michael Cotte: Revolutionizing Technology

Introduction: John Michael Cotte, a brilliant inventor hailing from New Fairfield, CT (US), is a pioneering figure in the realm of technological advancements. With a passion for innovation and a keen eye for detail, he has made significant contributions to various industries through his groundbreaking inventions.

Latest Patents: John Michael Cotte's latest patents include a cutting-edge smart home automation system that integrates artificial intelligence for enhanced efficiency and a revolutionary medical device designed to improve patient outcomes in critical care settings.

Career Highlights: Throughout his illustrious career, John Michael Cotte has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have garnered numerous awards and accolades, solidifying his reputation as a trailblazer in the field of invention.

Collaborations: John Michael Cotte has collaborated with leading technology companies and research institutions to bring his visionary ideas to life. His partnerships have been instrumental in turning his concepts into tangible products that have had a profound impact on society.

Conclusion: In conclusion, John Michael Cotte stands as a testament to the power of innovation and the transformative potential of inventions. His relentless pursuit of excellence and commitment to pushing the envelope have cemented his legacy as a true visionary in the world of technology.