David William Abraham

USPTO Granted Patents = 118 (Patent Applications = 15)

CIPO Patents = 1

EPO Patents = 3 (Patent Applications = 12)

Average Co-Inventor Count = 2.7

ph-index = 21

Forward Citations = 1,487(Granted Patents)

DiyaCoin

= 3.21

Inventors with similar research interests:

Location History:

Ossining, NY (US) (1991 - 2003)
Croton on the Hudson, NY (US) (2010)
Croton-on-Hudson, NY (US) (2002 - 2016)
Cronton, NY (US) (2016 - 2018)
Cronton on Hudson, NY (US) (2016 - 2020)
Croton, NY (US) (2002 - 2024)

Company Filing History:

116 out of 164,108

International Business Machines Corporation

patents

3 out of 244

Infineon Technologies North America Corp.

patents

2 out of 14,705

Infineon Technologies Ag

where one patent can have more than one assignee

Years Active: 1991-2025

where 'Filed Patents' based on already Granted Patents

118 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12324361 - Electrical connections between dissimilar materials at cryogenic temperatures (2025-06-03),

2. 12249748 - Edge capacitive coupling for quantum chips (2025-03-11),

3. 12150390 - Downstop and bump bonds formation on substrates (2024-11-19),

4. 12033981 - Create a protected layer for interconnects and devices in a packaged quantum structure (2024-07-09),

5. 11908756 - Interposer chips and enclosures for quantum circuits (2024-02-20),

6. 11804442 - Combined backing plate and housing for use in bump bonded chip assembly (2023-10-31),

7. 11676903 - Combined backing plate and housing for use in bump bonded chip assembly (2023-06-13),

8. 11411158 - Offset embedded ground plane cutout (2022-08-09),

9. 10937941 - Mechanically tunable superconducting qubit (2021-03-02),

10. 10833016 - Semiconductor device including superconducting metal through-silicon-vias and method of making the same (2020-11-10),

11. 10756410 - Coaxial transmission line slot filter with absorptive matrix (2020-08-25),

12. 10734567 - Bump bonded cryogenic chip carrier (2020-08-04),

13. 10727391 - Bump bonded cryogenic chip carrier (2020-07-28),

14. 10727192 - Multiple sized bump bonds (2020-07-28),

15. 10651099 - Non-destructive testing of integrated circuit chips (2020-05-12),

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Title: Innovator Spotlight: David William Abraham - Pushing the Boundaries of Quantum Technologies

Introduction:

David William Abraham, a remarkable inventor based in Ossining, NY (US), has left a lasting impact in the field of quantum technologies with his numerous patents and groundbreaking innovations.

Latest Patents:

David's latest patents showcase his expertise in the realm of quantum circuits. With inventions like "Interposer chips and enclosures for quantum circuits," he has pioneered techniques for qubit chip assemblies that enhance electrical communication within quantum systems. Additionally, his work on "Combined backing plate and housing for use in bump bonded chip assembly" demonstrates his ingenuity in forming electronic chip assemblies efficiently and effectively.

Career Highlights:

Having obtained a total of 114 patents, David William Abraham has proven to be a prolific inventor. His career highlights include notable contributions at established companies such as International Business Machines Corporation (IBM) and Infineon Technologies North America Corp., where he honed his skills and expertise in the technological landscape.

Collaborations:

Throughout his career, David has collaborated with esteemed professionals in the industry. Some of his coworkers, including Philip Louis Trouilloud and Daniel Christopher Worledge, have been instrumental in bringing his innovative ideas to fruition and pushing the boundaries of quantum technologies.

Conclusion:

In conclusion, David William Abraham's passion for innovation and his relentless pursuit of technological advancements have solidified his position as a pioneering inventor in the field of quantum technologies. His numerous patents and collaborations stand as a testament to his dedication and ingenuity, shaping the future of quantum computing and beyond.

This text is generated by artificial intelligence and may not be accurate.