The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Jul. 08, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
David Abraham, Croton, NY (US);
John Michael Cotte, New Fairfield, CT (US);
Nicholas A. Masluk, Putnam Valley, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/81 (2023.01); G06N 10/40 (2022.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H10N 60/81 (2023.02); G06N 10/40 (2022.01); H10N 60/01 (2023.02);
Abstract
A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.