John Hyunchul Hong

Title: John Hyunchul Hong: Innovator in 3-D Device Packaging

Introduction:

In the world of innovations and patents, John Hyunchul Hong has made a significant impact with his numerous inventions and patents related to 3-D device packaging with backside interconnections. Based in San Clemente, CA (USA), Hong has accumulated an impressive portfolio of 55 patents, showcasing his expertise in this specialized field.

Latest Patents: Integrated Packaging Devices and Methods with Backside Interconnections

One of Hong's notable inventions is the concept of integrated packaging devices and methods with backside interconnections. These inventions aim to hermetically seal one or more device elements from the ambient environment using vacuum lamination and bonding techniques. The key feature of this invention is the inclusion of via connections, facilitating electrical interconnection between device elements and the back side of the device substrate. The back side of the device substrate is then further connected to external circuitry, such as printed circuit boards (PCBs) or flex circuits. This integration enables enhanced functionality and improved performance of 3-D devices.

Collaborations and Work Experience:

Throughout his career, John Hyunchul Hong has contributed his expertise to various well-known companies in the tech industry. He has worked for Obsidian Sensors Inc., a renowned technology company focused on sensor development, as well as QUALCOMM Incorporated, a leading global semiconductor and telecommunications equipment company.

Collaborators:

Hong has had the privilege of working alongside talented individuals in creating groundbreaking innovations. Notable colleagues include Chong U Lee and Tallis Young Chang. Their collective efforts have contributed to the development of cutting-edge technologies in the field of 3-D device packaging.

Conclusion:

John Hyunchul Hong's expertise in 3-D device packaging with backside interconnections has propelled him to the forefront of innovation in the tech industry. With 55 patents to his name and his valuable contributions to companies like Obsidian Sensors Inc. and QUALCOMM Incorporated, Hong has cemented his position as a key figure in this specialized field. Through his inventions, he has pushed the boundaries of device packaging, enabling more efficient and functional 3-D devices.