Qualcomm Mems Technologies, Inc.

Qualcomm Incorporated

Obsidian Sensors, Inc.

Snaptrack Incorporated

John Hyunchul Hong

Chong U Lee

Tallis Young Chang

Jian Jim Ma

Bing Wen

Edward Chan

Onur Canturk Hamsici

Sundeep Vaddadi

Yuriy Reznik

Cheonhong Kim

Yaoling Pan

Sean Andrews

Kenji Nomura

Je-Hsiung Lan

Marc Mignard

Jonghae Kim

Ion Bita

Alok Govil

Robert Sean Daley

Chi Shun Lo

Frederick Duke Kim

Heesun Shin

Tze-Ching Fung

Mario Francisco Velez

Huanzhao Zeng

Jay Chunsup Yun

Seung-Tak Ryu

Edward Keat Leem Chan

Murali Chari

Pawan Kumar Baheti

Ashwin Deepak Swaminathan

Hong-Son Ryang

Khurshid Syed Alam

Devender Akira Yamakawa

Kristopher Andrew Lavery

Jose Ricardo Dos Santos

Shen-Ge Wang

Ming Ying

Brandon Hong

Jan Bos

Isak Clark Reines

Joseph Huang

Yi-Nan Chu

Mark K Murphy

Murali Ramaswamy Chari

Chong Uk Lee

Jia-Wei Ma

Devender A Yamakawa

José R Dos Santos

Data converter circuits and methods of operating the data converter circuits are disclosed. In some embodiments, a data converter circuit includes a charge measurement circuit. In some embodiments, the charge measurement circuit is a capacitive transimpedance amplifier (CTIA). In some embodiments, the data converter circuit includes the CTIA, a quantizer, a digital-to-analog converter, a summer, and a digital filter. In some embodiments, the data converter circuit includes an analog-to-digital converter electrically coupled to the CTIA and the digital filter. In some embodiment, a method includes integrating an input signal with a CTIA, determining whether a CTIA output signal is greater than a threshold, and reducing the CTIA output signal or forgoing the reducing based on the determination of whether the CTIA output signal is greater than the threshold.

Adaptive charge measurement circuit for data converters

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

Charge transfer circuitry for MEMS devices

Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

Readout circuits and methods

Systems and methods for spectrometry are disclosed. In some embodiments, the system comprises a Fourier Transform Spectrometer (FTS) comprising a waveguide and a delay element. In some embodiments, the method comprises determining a power spectral density of an input optical signal via the FTS.

Fourier transform spectrometer

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.

Active matrix programmable mirror

A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.

MEMS and NEMS structures

Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.

In-display fingerprint sensing system

Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

MEMS sensors and systems

A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.

Capping plate for panel scale packaging of MEMS products

Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

Integrated packaging devices and methods with backside interconnections

A device includes a substrate with a curvilinear perimeter segment adjoined to a plurality of facets, a display area, a border area surrounding the display area, and connection pads, divided into groups corresponding to the facets, in the border area. A flexible circuit board with arms coupled to the groups of connection pads is included. Another device includes a substrate having a display area, first connection pads within a border area peripheral to the display area, and a flexible circuit board having a first portion including second connection pads configured to be coupled to the first connection pads, and a second portion configured to accommodate a plurality of transmission lines extending from the second connection pads. An arc length of the first portion can be greater than that of the second portion and a center-to-center pitch of the second connection pads can be greater than that of the transmission lines.

Display panel with minimum borders

A method includes forming a replica circuit above a surface of a glass-type material. The replica circuit includes a thin-film transistor (TFT) configured to function as a variable capacitor or a variable resistor. The method further includes forming a transformer above the surface of the glass-type material. The transformer is coupled to the replica circuit, and the transformer is configured to facilitate an impedance match between the replica circuit and an antenna.

Integration of a replica circuit and a transformer above a dielectric substrate

Growing community of inventors

San Clemente, CA, United States of America

John Hyunchul Hong