John G Meyers

Title: Innovations of John G Meyers

Introduction

John G Meyers is a prominent inventor based in Sacramento, CA, known for his significant contributions to electronic assembly technologies. With a total of 17 patents to his name, Meyers has made a notable impact in the field of electronics and integrated circuit design.

Latest Patents

Among his latest innovations is the "Die stack with cascade and vertical connections." This electronic assembly features a plurality of electronic die arranged into shingles, with each shingle containing multiple offset stacked die coupled by cascading connections. The design allows for vertical electrical connections from the top of the assembly to the bottom die of each shingle, enhancing the efficiency of electronic devices. Another significant patent is the "Packaged integrated circuit device with recess structure." This device includes a substrate with contacts disposed on its side, defining a recess region that facilitates connections between integrated circuit dies and printed circuit boards.

Career Highlights

Meyers has had a distinguished career, working with leading companies in the technology sector, including Intel Corporation. His work has been instrumental in advancing electronic assembly techniques and integrated circuit packaging.

Collaborations

Throughout his career, Meyers has collaborated with notable professionals in the field, including Bilal Khalaf and Florence R Pon. These collaborations have contributed to the development of innovative technologies and solutions in electronics.

Conclusion

John G Meyers continues to be a driving force in the field of electronics, with his patents reflecting his innovative spirit and technical expertise. His contributions have significantly advanced the capabilities of electronic assemblies and integrated circuits.