The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Dec. 16, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Mao Guo, Shanghai, CN;
John G. Meyers, Sacramento, CA (US);
Yong She, Songjiang, CN;
Bin Liu, Shanghai, CN;
Lingyan L. Tan, Shanghai, CN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 23/02 (2013.01); H01L 23/5385 (2013.01); H01L 25/065 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A system in package and method of making as system in package are disclosed. The system in package has a substrate () with a plurality of passive devices () mounted thereon. A molding compound () envelopes the plurality of passive devices () to define a flat surface () substantially parallel to a surface of the substrate (). A plurality of integrated circuit dies () is coupled successively to the flat surface ().