The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Sep. 12, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
John Meyers, Sacramento, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/50 (2013.01); H01L 24/06 (2013.01); H01L 25/0657 (2013.01);
Abstract
A microelectronic package may be fabricated having at least one microelectronic die attached to a microelectronic substrate, wherein the microelectronic substrate includes at least one notch formed in at least one side thereof. The microelectronic dice may be attached to a first surface of the microelectronic substrate and in electronic communication with a bond pad on a second surface of the microelectronic substrate with a bond wire which extends through the notch in the microelectronic substrate.