The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Sep. 30, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
John G. Meyers, Sacramento, CA (US);
Leo J. Craft, Shingle Springs, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 23/535 (2006.01); H01L 27/105 (2006.01); H05K 7/14 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01R 12/73 (2011.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/522 (2013.01); H01L 23/5226 (2013.01); H01L 23/535 (2013.01); H01L 25/0652 (2013.01); H01L 27/1052 (2013.01); H05K 7/1424 (2013.01); G11C 5/02 (2013.01); G11C 5/06 (2013.01); H01R 12/737 (2013.01); H05K 7/1447 (2013.01); H05K 7/1452 (2013.01); H05K 7/20136 (2013.01);
Abstract
A data storage system is described that uses wafer-level packaging. In one embodiment an apparatus includes a silicon wafer, a plurality of memory cells formed directly on the wafer, an encapsulant formed over the memory cells, a plurality of wiring connections to connect the memory cells to an external interface, a memory controller, and an external interface.