John A Trezza

This inventor holds 108 USPTO granted patents and 3 published patent applications, plus 1 CIPO patent and 1 EPO patent, primarily in Chip Packaging Technology (CPC class H01L2-100). Top assignees: Cufer Asset Ltd. L.l.c., Xanoptix Inc., Teraconnect, Incorporated. Active years: 1999-2019.

USPTO Granted Patents = 108 (Patent Applications = 3)

% Patents Active = 88.9

CIPO Patents = 1

EPO Patents = 1

Average Co-Inventor Count = 1.4

ph-index = 23

Forward Citations = 1,745(Granted Patents)

Forward Citations (Not Self Cited) = 1,614(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Manalapan, NJ (US) (2010 - 2014)
Nashua, NH (US) (1999 - 2019)

Company Filing History:

27 out of 40

Cufer Asset Ltd. L.l.c.

Teraconnect, Incorporated

Cufer Assett Ltd. L.l.c.

patent

8. 1 out of 5,509

Leland Stanford Junior University

patents

9. 1 out of 1

Teraconnect, Incoporated

11. 25 out of 834,453

Other

patents

Years Active: 1999-2019

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Areas of Expertise:

Chip Packaging

Capacitive Coupling

Tooling

Multicolor Detectors

Thermally Balanced Via

Remote Chip Attachment

Coaxial Through Chip Connection

Wafer Via Formation

Triaxial Through-Chip Connection

Heat Cycle-able Connection

Isolating Chip-to-Chip Contact

Stacked Chip-Based System

108 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10340239 - Tooling for coupling multiple electronic chips (2019-07-02),

2. 9754907 - Tooling for coupling multiple electronic chips (2017-09-05),

3. 9324629 - Tooling for coupling multiple electronic chips (2016-04-26),

4. 9147635 - Contact-based encapsulation (2015-09-29),

5. 8860083 - Low noise hybridized detector using charge transfer (2014-10-14),

6. 8846445 - Inverse chip connector (2014-09-30),

7. 8766159 - Multicolor detectors and applications thereof (2014-07-01),

8. 8643186 - Processed wafer via (2014-02-04),

9. 8499434 - Method of making a capacitive sensor (2013-08-06),

10. 8456015 - Triaxial through-chip connection (2013-06-04),

11. 8399820 - Multicolor detectors and applications thereof (2013-03-19),

12. 8283778 - Thermally balanced via (2012-10-09),

13. 8232194 - Process for chip capacitive coupling (2012-07-31),

14. 8197627 - Pin-type chip tooling (2012-06-12),

15. 8197626 - Rigid-backed, membrane-based chip tooling (2012-06-12),

Title: The Innovative Mind of John A Trezza

Introduction:

John A Trezza, a prolific inventor hailing from Nashua, NH, has left an indelible mark on the world of technology with an impressive portfolio of 108 patents. His groundbreaking work in the realm of electronic chip tooling has revolutionized the industry, showcasing his ingenuity and expertise.

Latest Patents:

Among his latest patents is a cutting-edge tooling design for coupling multiple electronic chips. This method involves utilizing a hardenable material to constrain and align the chips, applying pressure to ensure a secure bond without causing damage to the components. This innovation highlights Trezza's commitment to precision and efficiency in technological advancements.

Career Highlights:

Throughout his career, John A Trezza has been associated with reputable companies such as Cufer Asset Ltd. L.L.C., where he has contributed immensely to research and development. His exceptional talent for problem-solving and innovation has earned him recognition as a pioneer in his field.

Collaborations:

Trezza has had the privilege of collaborating with esteemed colleagues such as Keith Kang and Gregory Dudoff. Together, they have synergized their talents and expertise to bring forth groundbreaking solutions and push the boundaries of technological innovation.

Conclusion:

In conclusion, John A Trezza stands as a beacon of inspiration in the world of inventions and patents. His remarkable contributions have not only transformed the industry but have also paved the way for future innovations. With his unparalleled dedication and visionary outlook, Trezza continues to shape the landscape of technology and propel it into the future.