The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Mar. 30, 2007
Applicants:
Roger Dugas, Chester, NH (US);
John Trezza, Nashua, NH (US);
Inventors:
Roger Dugas, Chester, NH (US);
John Trezza, Nashua, NH (US);
Assignee:
CUFER ASSET LTD. L.L.C., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/165 (2006.01); B29C 65/00 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01S 5/042 (2006.01); H01L 23/488 (2006.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/48 (2013.01); H01L 23/481 (2013.01); H01L 23/488 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/02 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01S 5/0425 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6622 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/114 (2013.01); H01L 2224/116 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11912 (2013.01); H01L 2224/136 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/1358 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/75 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/06593 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01); H01S 5/02272 (2013.01); H01S 5/0422 (2013.01); H01S 5/183 (2013.01); H01S 5/18308 (2013.01); H01S 2301/176 (2013.01);
Abstract
A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.