The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Jun. 20, 2011
Applicant:
John Trezza, Nashua, NH (US);
Inventor:
John Trezza, Nashua, NH (US);
Assignee:
Cufer Asset Ltd. L.L.C., Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01S 5/042 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/427 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/66 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01S 5/183 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01S 5/0425 (2013.01); H01S 5/183 (2013.01); H01S 5/02272 (2013.01); H01S 2301/176 (2013.01); H01S 5/0422 (2013.01); H01S 5/18308 (2013.01); H01L 2224/81204 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/014 (2013.01); H01L 2224/116 (2013.01); H01L 23/49827 (2013.01); H01L 2924/01047 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/01018 (2013.01); H01L 2221/68368 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/1308 (2013.01); H01L 2924/01004 (2013.01); H01L 2224/13082 (2013.01); H01L 2924/01042 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/16146 (2013.01); H01L 2924/01014 (2013.01); H01L 24/16 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/13111 (2013.01); H01L 2924/01046 (2013.01); H01L 5/183 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01032 (2013.01); H01L 23/481 (2013.01); H01L 2224/136 (2013.01); H01L 2225/06589 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/81203 (2013.01); H01L 24/81 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/1358 (2013.01); H01L 2924/01073 (2013.01); H01L 25/50 (2013.01); H01L 2224/81894 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01075 (2013.01); H01L 24/13 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/114 (2013.01); H01L 2224/81136 (2013.01); H01L 2225/06534 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/05042 (2013.01); H01L 21/76898 (2013.01); H01L 2224/92125 (2013.01); H01L 24/75 (2013.01); H01L 2924/01028 (2013.01); H01L 2224/13147 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/01002 (2013.01); H01L 24/24 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/01025 (2013.01); H01L 23/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/24226 (2013.01); H01L 2924/00013 (2013.01); H01L 23/66 (2013.01); H01L 2924/19041 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/81054 (2013.01); H01L 2924/01049 (2013.01); H01L 2225/06531 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01007 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/75305 (2013.01); H01L 2924/3011 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/0105 (2013.01); H01L 21/6835 (2013.01); H01L 2924/01005 (2013.01); H01L 2223/6616 (2013.01); H01L 24/02 (2013.01); H01L 2924/01006 (2013.01); H01L 2225/06555 (2013.01); H01L 2221/68363 (2013.01); H01L 24/11 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/10329 (2013.01); H01L 2224/75 (2013.01); H01L 2924/14 (2013.01); H01L 2224/83102 (2013.01); H01L 23/5389 (2013.01); H01L 2924/19043 (2013.01); H01L 25/0652 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/13609 (2013.01); H01L 2924/04953 (2013.01); H01L 23/552 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/13166 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01078 (2013.01); H01L 2223/6622 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A system for connecting a first chip to a second chip having a post on the first chip having a first metallic material, a recessed wall within the second chip and defining a well within the second chip, a conductive diffusion layer material on a surface of the recessed wall within the well, and a malleable electrically conductive material on the post, the post being dimensioned for insertion into the well such that the malleable electrically conductive material will deform within the well and, upon heating to at least a tack temperature for the malleable, electrically conductive material, will form an electrically conductive tack connection with the diffusion layer to create an electrically conductive path between the first chip and the second chip.