The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Dec. 13, 2010
Applicants:
John Trezza, Nashua, NH (US);
John Callahan, Wilmington, MA (US);
Gregory Dudoff, Amherst, NH (US);
Inventors:
Assignee:
CUFER ASSET LTD. L.L.C., Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/427 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/488 (2006.01); H01S 5/022 (2006.01); H01S 5/042 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/48 (2013.01); H01L 23/481 (2013.01); H01L 23/488 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/02 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01S 5/0425 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6622 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/114 (2013.01); H01L 2224/116 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11912 (2013.01); H01L 2224/136 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/1358 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/75 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/06593 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01); H01S 5/02272 (2013.01); H01S 5/0422 (2013.01); H01S 5/183 (2013.01); H01S 5/18308 (2013.01); H01S 2301/176 (2013.01);
Abstract
An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.
Trezza, John. (2015). Contact-based encapsulation (U.S. Patent No. 9147635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9147635
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile