Jiung Wu

Title: Jiung Wu: Innovator in Semiconductor Technology

Introduction

Jiung Wu is a prominent inventor based in Kueishan Shiang, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on advanced structures and methods that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents are innovations such as the die stacking structure and the semiconductor package, along with the formation method of the die stacking structure. This die stacking structure includes a first device die and second device dies that are bonded onto the first device die and arranged side-by-side. Additionally, it features a stack of dielectric layers that extend between the second device dies, laterally enclosing each of them. The dielectric layers are formed from either spin-on-glass (SOG) or a polymer, with the lower dielectric layer being thicker than the higher ones. Another notable patent involves the profile of through via protrusion in 3DIC interconnect, which provides an interconnect structure for integrated circuits, including a substrate and a through via extending through it.

Career Highlights

Jiung Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing cutting-edge technologies that push the boundaries of what is possible in semiconductor design and manufacturing.

Collaborations

Throughout his career, Jiung Wu has collaborated with notable colleagues, including Wen-Chih Chiou and Ku-Feng Yang. These partnerships have fostered innovation and have contributed to the advancement of semiconductor technologies.

Conclusion

Jiung Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor solutions.