The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Jan. 12, 2012
Chen-hua Yu, Hsin-Chu, TW;
Wen-chih Chiou, Miaoli, TW;
Fang Wen Tsai, Hsin-Chu, TW;
Kuang-wei Cheng, Hsin-Chu, TW;
Jiann Sheng Chang, Hsin-Chu, TW;
Yi Chou Lai, Taichung, TW;
Jiung Wu, Kueishan Shiang, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Wen-Chih Chiou, Miaoli, TW;
Fang Wen Tsai, Hsin-Chu, TW;
Kuang-Wei Cheng, Hsin-Chu, TW;
Jiann Sheng Chang, Hsin-Chu, TW;
Yi Chou Lai, Taichung, TW;
Jiung Wu, Kueishan Shiang, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
System and method for reducing substrate warpage in a thermal process. An embodiment comprises pre-heating a substrate in a loadlock chamber before performing the thermal process of the substrate. After the thermal process, the substrate is cooled down in a loadlock chamber. The pre-heat and cool-down process reduces the warpage of the substrate caused by the differences in coefficients of thermal expansion (CTEs) of the materials that make up the substrate.